LIQUID CRYSTAL POLYMERS
FOR HIGH-SPEED, HIGH-FREQUENCY ELECTRONICS
THE NEED FOR RELIABILITY
Cutting-edge 5G electronic devices operate at faster speeds and higher frequencies by incorporating critical, high-reliability antenna components that operate with minimal delay – referred to as low latency. Flexible Printed Circuit Boards (PCBs) are the foundation for these devices – up to a dozen potentially in each device.
Copper Clad Laminates (CCLs) are the core substrate material in PCBs. These CCLs are made up of a polymer-based dielectric layer with unique electrical and signal properties sandwiched between copper foils. Polyamide or Modified Polyamide are the primary materials of choice, but suffer from limited moisture resistance and temperature stability, driving a need for specialized materials to meet application demands.
Liquid crystal polymers (LCPs) provide a novel and exceptional alternative, due to thermal stability, high moisture resistance, and excellent electrical properties – low dielectric constant and dielectric loss.
We UTILIZE BASE LCP RESINS AND TAILOR THEIR MATERIAL PROPERTIES — ELECTRICAL, MECHANICAL AND THERMAL — TO IMPROVE PERFORMANCE AND INCREASE RELIABILITY
USING LCPs TO MEET MARKET NEEDS
Our polymer expertise enables us to customize solutions to meet very specific technical, and often challenging, requirements.
Not only do our LCPs exceed the stringent requirement for 5G applications, they also enable the use of highly desirable rolled-annealed (RA) copper. The use of lower-cost, smoother RA copper is based on our superior adhesion, resulting in a final solution that delivers low dielectric and insertion loss.
Until the development of this LCP family, LCP technology experienced issues that made it less than ideal as a solution. But we’ve been able to crack the code on performance, adhesion and manufacturing issues that allow us to meet next-generation requirements.
DELIVERING ADVANCED TECHNOLOGY AND PRODUCTION-READY MANUFACTURING
Deep Polymerization Expertise
Our advanced polymer expertise allows us to tailor the chemical, thermoelectric and mechanical properties of base polymers to meet very specific application requirements and form factors.
In addition to our polymer material knowledge, we also understand the unique processing development challenges required for high-volume LCP manufacturing.
SERVING HIGH-PERFORMANCE MARKETS
We are currently focused on delivering flexible LCP laminates to serve the needs of 5G electronics, but there are also needs beyond 5G devices. LCP’s inherent qualities give it great potential for a range of uses across electronic laminates, as well as other uses such as injection-molded structural components. Each of these applications has requirements that go beyond the ability of today’s basic LCPs – but with our polymer expertise, we are creating the next-generation, smarter LCP.